The benefits of integrated photonics for OPAs
Using integrated optics, LioniX International is fabricating nanoscale optical components directly into Photonic Integrated Circuit (PIC) chips. This approach has several benefits:
Smaller and lighter with lower power consumption
Miniature OPAs built into PICs enable efficient transfers of power between components and have no moving parts, resulting in a system with much lower power consumption.
PICs are much more resistant to mechanical shocks than systems relying on separate components or those with moving parts. Temperature regulation across a PIC is also straight-forward, increasing the operating temperature range and reducing sensitivity to temperature variations.
Monolithic microfabrication processes enable very high precision optics, with tolerance of tens of nanometres on component features. The components that can be realized through these methods enable very tight control over the phase of the light, essential for high fidelity beam scanning.
Cost reduction and volume scaling
The bulk microfabrication processes used to manufacture PIC-based OPAs are highly scalable. This is driving down costs towards a target of <$500 per OPA for mass-market sensing applications.
Next generation OPAs at LioniX International
With low-loss TriPleX® waveguides, novel tunable optics and expertise in integrating high-performance active components, LioniX International enables OPA improvements including:
A wide choice of wavelengths
Our silicon nitride waveguide platform is transparent from 400nm to 2350nm, enabling unparalleled flexibility in the use of different colors of light.
High-speed beam steering
Solid-state beam scanning relies on fast tunable optics. LioniX International’s novel stress-optic tuning elements offer tuning rates up to a thousand times faster than other optical tuning components (e.g. thermo-optic modulators).
Ultra-low power consumption and denser features
Our stress-optic beam steering offers power consumption many orders of magnitude lower than thermo-optic tuners. Furthermore, without the thermal cross talk from heater-based tuners, tuning elements can more densely packed for smaller chip sizes.
Hybrid integration for tailored performance
We specialize in hybrid OPA modules that combine the best performing lasers, modulators and low-loss waveguides. This approach means we are not tied to one platform. We put the functionality where it fits best and tailor device performance to your application.