Wet etching process capabilities for bulk micromachining

We offer a full range of bulk micromachining processes using specialized etching steps. Chemical etching allows for the selective removal of layers of wafer material. Our wet etching capability for MEMS bulk micromachining includes isotropic and anisotropic wafer etching processes including:

  • KOH and TMAH anisotropic etching of silicon
  • (B)HF etching of silicon dioxide (SiO­2)
  • Phosphoric acid (H3PO4) etching of silicon nitride (Si3N4)
  • Metal etching (Al, Au, Cr, Mo, Cu, Ni and more)