Wafer dicing and back end processes
Make use of over 20 years of experience in back-end processing, integration of optical chips, hybrid integration and fluidics. Our services include:
Wafer dicing process
We specialize in silicon wafer dicing and the dicing of different substrates. Chips are characterized and delivered in trays after dicing, or on blue foil
Our deep expertise in wire bonding comes from 20 years’ of experience developing microsystems solutions for OEMs and system integrators. We offer one-stop-shop solutions for the integration of your device and can advise on the best layout for integration of wire bonds and electrical interfaces.
Flip chip bonding and pig tailing of optical chips
We are experts in the integration of other functions into your design, whether through in-plane integration or flip chip methods, we incorporate optical and electrical functionality to maximize your device utility.
LioniX International has significant experience with integrating microfluidic functionality to create added value. As specialists in lab-on-a-chip and biosensing fields, we have developed significant expertise in fully functional fluidic systems. These typically involve the integration of chip holders, fluidic interfacing, electronic- and software control systems.