ABOUT PROJECT QUSCALE:
Quantum computing represents a new frontier for increased processing power, the further minimization of electronic devices, and solving computational problems that classical computers are altogether unable to. However, there are many obstacles to be cleared before quantum computers can be used in consumer goods. Primary amongst them is scalable production: while there have been numerous successes in making functional quantum computers, they exist only as single machines for research use. These are large, intricate devices with very specific working conditions. For market deployment, quantum computers must be designed for large volume manufacturing. This project, funded by the Recovery Assistance for Cohesion and the Territories of Europe (REACT-EU), is a step in that direction.
QuiX Quantum have successfully realized a very small photonic quantum processor with a record-setting 20 qumode size. To make larger processor in a scalable fashion, the connections between the photonic processing chip and the electrical components of the processor (single photon sources and detectors, control electronics, et cetera) must be redesigned. A device acting as an interconnection facilitator between photonic and electronic components will be developed within this project to streamline the design and production steps of future processors. This interposer will be usable for varying chip sizes, cost effective, and allow for performance increases. The project will also simplify current designs for high qumode devices, allowing for simpler connection techniques to be implemented before the interposer is ready for large volume production.
Schematic of the proposed QuScale module, with an interposer handling the connections between the photonic and electronic components of the photonic quantum processor.
THE ROLE OF LIONIX INTERNATIONAL:
As the manufacturer of the photonic chips used in QuiX’ quantum processors, LioniX International will be involved in the redesigning process. Our expertise in integrating ultra-low loss silicon nitride with other photonic and electronic platforms will help with facilitating the interposer design process. While the optical architecture of the chip will be maintained, the metal layer on top contains the electrical contacts to which the interposer will connect. Each optical switch on the photonic chip will have a corresponding pair of electrical contacts, such that the design can be replicated for any number of modes on the photonic chip. Thousands of on-chip switches can be easily accommodated with this approach.
We are also responsible for the manufacturing of the new processor chips. The current manufacturing process for the photonic chips will be adapted for the new design. Post-processing methods will also be tested for increased optical performance of the processor. Our consortium partners will test these chips and provide feedback for additional improvements.