ABOUT THIS PROJECT:
PIXAPP is the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line, and helps users exploit the breakthrough advantages of PIC technologies. PIXAPP consists of a highly-interdisciplinary team of Europe’s leading industrial & research organisations, and provides users with single-point access to PIC assembly and packaging.
THE ROLE OF LIONIX INTERNATIONAL:
LioniX International is in the PIXAPP project with the TriPleX® platform in which via spot size converters a complementary combination with the other PIC based platforms can be made. Hybrid combination of different platforms enables new applications and the TriPleX® acts as the photonic backbone there. Due to the vertical integration of LioniX International the role in the PIXAPP project goes much further than just applying TriPleX PICs.
Find more information about this project and its progress on the PIXAPP website.