• Photonics Packaging Made Visible
    Scalable assembly and packaging of photonic integrated circuits for emerging applications
    Yiwei Xie, Zihan Geng, Leimeng Zhuang, Maurizio Burla, Caterina Taddei, Marcel Hoekman, Arne Leinse, Chris G.H. Roeloffzen, Klaus-J. Boller, Arthur J. Lowery
    Publisher: De Gruyter; Published: Nanophotonics, Volume 7, Issue 2, December 2017; DOI: 10.1515/nanoph-2017-0077