Packaging Service

LioniX International offers several solutions and services for assembly and packaging of Photonic Integrated Circuits (PIC). These specifically apply to prototypes, demonstration models and small-volume series of end products. LioniX International offers services to support you with the realization of your complete optical system. From singulation and characterization of bare chips and pieces of wafers […]

Multi Project Wafer Service

To enable you a low cost easy access to our photonic integrated circuit technology, suitable for components for telecom/datacom as well as sensing applications, LioniX International offers together with PhoeniX Software the regular Multi Project Wafer (MPW) runs in the TriPleX™ technology. LioniX International and PhoeniX Software provide in addition to chip manufacturing: Training on […]

Nano & MEMS Services

LioniX International has a mature technology portfolio for deposition and etching of both glass and silicon based materials. The photonic modules that we realize for our OEM customers have always driven the optimization of our technology portfolio and offering as the requirements for photonic products are very demanding. Already from the beginning of  2001 a […]