Packaging Service

LioniX International offers several solutions and services for assembly and packaging of Photonic Integrated Circuits (PIC). These specifically apply to prototypes, demonstration models and small-volume series of end products.

LioniX International offers services to support you with the realization of your complete optical system. From singulation and characterization of bare chips and pieces of wafers to pigtailing of fibers and fiber arrays to PICs, hybrid integration of different PICs and to mounting the optical assembly including the driving electronics in standardized or customized housings.

Fiber (array) to PIC

We have extensive expertise on various kinds of integrated optical technologies like, InP, SOI, glass or TriPleX™. Our team of optical engineers have over 30 man-year of experience with attaching single fibers and fiber arrays to different kind of optical chips, fabricated using the above mentioned technologies. Standard single mode fibers or specialty fibers can be attached at one or multiple facets of the PIC.

Hybrid PIC to PIC

For applications that require the hybrid integration of multiple PIC technologies, like spotsize or mode conversion between single mode fiber and high contrast PIC technology, we offer services to assemble multiple PICs. For example a spotsize and pitch converter in TriPleX™ can be attached to an InP high contrast PIC.

Specialty fiber arrays

Besides the standard single mode fiber arrays, we also offer specialty fiber arrays. These consist of polarization maintaining or non-telecom fibers or have multiple fiber types in a single fiber array. Also the outer dimension of the fiber array can be adapted to create for example very thin fiber arrays.

Integration of electronics

Many applications require the PIC to be driven through an electronic interface. LioniX International integrates different types of electrical interfaces by wirebonding and flip-chipping to PCB or ceramics.

Photonic component package

We offer several standard and customized packages for prototype assembly. Design rules for the standardized packages are described in the design manual, available through our partner PhoeniX Software. The PIC assembly is wirebonded and strain-reliefs are added to create a robust module. Active temperature control is established through use of peltier elements and customized heatsinks to suit your application best.

Multi Project Wafer Service

To enable you a low cost easy access to our photonic integrated circuit technology, suitable for components for telecom/datacom as well as sensing applications, LioniX International offers together with PhoeniX Software the regular Multi Project Wafer (MPW) runs in the TriPleX™ technology.

LioniX International and PhoeniX Software provide in addition to chip manufacturing:

  • Training on design tools
  • Special offer for simulation tools and mask layout software
  • Design kit
  • Design support

In addition we offer post processing upon request:

  • Etching trenches for fluidic applications
  • Etching trenches next to waveguides for heat localization
  • Packaging (in particular fiber chip coupling)
  • Glass bonding and fluidic connection
  • Polishing

Interested parties can contact us by sending an e-mail to:


The TriPleX™ waveguides offered within this MPW are designed for single polarization (TE) applications to operate at the telecom wavelength (1.55 µm). The waveguide however is also transparent for lower wavelengths. The TriPleX™ technology has applications from 405nm to 2.35µm. In addition, these waveguides show a low propagation loss (< 0.5 dB/cm @ 1.55µm). The high contrast waveguide allows bend radii of 125 micron, which makes large scale integration (VLSI) on chip possible. The coupling to and from a fiber from this high contrast waveguide is optimized by the addition of spot size converters , which expand the mode profile to the size of a standard telecom fiber, allowing low loss fiber chip coupling.

The offered waveguides consist of a double stripe shown in Figure 2 using layers of Si3N4 (170 nm) with a high refractive index. Furthermore the cladding and core region consist of SiO2. The core layer between the nitride stripes is 500 nm thick. The entire waveguide will be realized on 100 mm silicon wafers with 8 µm thermal oxide and thermo-optic phase shifters will be applied on top of the waveguide.

The process includes a “double stripe” waveguide geometry, thermo-optic phase shifters and spot size converters and 4 dies will be supplied to the customer.

sem photo - small cross section - small

Figure 2: Cross-section of the TriPleX™ waveguide in Si3N4 with SiO2 cladding. Left: schematic cross section, Right: SEM image of realized structure


TriPleX™ Background

In the last years the proprietary TriPleX™ waveguide technology [1][2] of LioniX has been further developed and has become one of the three main integrated optical platforms (besides InP and SOI) in the world. TriPleX™ structures are realized with CMOS compatible fabrication equipment and the materials used are based on chemical end products of LPCVD processes, resulting in very reproducible material properties, allowing design by geometry. The basic concept of a TriPleX™ waveguide consists of a multilayer stack of stoichiometric silicon nitride and silicon oxide. These materials have an opposite stress when deposited on a silicon wafer (nitride is tensile and oxide is compressive) and stacking them in a multilayer results in a macroscopically low stress layer stack. The fabrication process can be used to realize a variety of geometries. The differences are based on etchdepth, layerthickness and waveguide width. Three “standard” geometries are shown in Figure 3.

Figure 3:



14th run15th run16th run
TrainingDecember 2017April 2018September 2019
Tape outMarch 2018September 2018February 2019
Devices readyJuly 2018January 2019June 2019


MPW Technology – Visible

For the visible (400-700 nm) the MPW is offered through an EU H2020 funded pilot-line project called PiX4life. This project will mature a state of the art silicon nitride (SiN) photonics pilot line for life science applications in the visible range and pave the way to make it accessible as an enabler for product development by a broad range of industrial customers. See for more information including the planning.

 Interested parties can contact us by sending an email.


LioniX International develops customized MEMS solutions and produces them in small to medium volumes.

Visit our MEMS website for more information.