To enable you a low cost easy access to our photonic integrated circuit technology, suitable for components for telecom/datacom as well as sensing applications, LioniX International offers together with PhoeniX Software the regular Multi Project Wafer (MPW) runs in the TriPleX™ technology.
LioniX International and PhoeniX Software provide in addition to chip manufacturing:
- Training on design tools
- Special offer for simulation tools and mask layout software
- Design kit
- Design support
In addition we offer post processing upon request:
- Etching trenches for fluidic applications
- Etching trenches next to waveguides for heat localization
- Packaging (in particular fiber chip coupling)
- Glass bonding and fluidic connection
Interested parties can contact us by sending an e-mail to: email@example.com.
The TriPleX™ waveguides offered within this MPW are designed for single polarization (TE) applications to operate at the telecom wavelength (1.55 µm). The waveguide however is also transparent for lower wavelengths. The TriPleX™ technology has applications from 405nm to 2.35µm. In addition, these waveguides show a low propagation loss (< 0.5 dB/cm @ 1.55µm). The high contrast waveguide allows bend radii of 125 micron, which makes large scale integration (VLSI) on chip possible. The coupling to and from a fiber from this high contrast waveguide is optimized by the addition of spot size converters , which expand the mode profile to the size of a standard telecom fiber, allowing low loss fiber chip coupling.
The offered waveguides consist of a double stripe shown in Figure 2 using layers of Si3N4 (170 nm) with a high refractive index. Furthermore the cladding and core region consist of SiO2. The core layer between the nitride stripes is 500 nm thick. The entire waveguide will be realized on 100 mm silicon wafers with 8 µm thermal oxide and thermo-optic phase shifters will be applied on top of the waveguide.
The process includes a “double stripe” waveguide geometry, thermo-optic phase shifters and spot size converters and 4 dies will be supplied to the customer.
Figure 2: Cross-section of the TriPleX™ waveguide in Si3N4 with SiO2 cladding. Left: schematic cross section, Right: SEM image of realized structure
In the last years the proprietary TriPleX™ waveguide technology  of LioniX has been further developed and has become one of the three main integrated optical platforms (besides InP and SOI) in the world. TriPleX™ structures are realized with CMOS compatible fabrication equipment and the materials used are based on chemical end products of LPCVD processes, resulting in very reproducible material properties, allowing design by geometry. The basic concept of a TriPleX™ waveguide consists of a multilayer stack of stoichiometric silicon nitride and silicon oxide. These materials have an opposite stress when deposited on a silicon wafer (nitride is tensile and oxide is compressive) and stacking them in a multilayer results in a macroscopically low stress layer stack. The fabrication process can be used to realize a variety of geometries. The differences are based on etchdepth, layerthickness and waveguide width. Three “standard” geometries are shown in Figure 3.
|11th run||12th run||13th run|
|Training||September 2016||February 2017||June 2017|
|Tape out||December 2016||May 2017||October 2017|
|Devices ready||April 2017||September 2017||February 2018|