Artificial Intelligence (AI)
Artificial Intelligence (AI) has rapidly become one of the most demanding fields in terms of compute and data requirements. While computational power is scaling quickly, the true bottlenecks to AI adoption lie in bandwidth, power efficiency, and device reliability. Traditional ICs could not keep pace with these demands.
Photonics is now well established as the key to enabling scalable AI infrastructure. Photonic Integrated Circuits (PICs) already support high-speed data transfer, but their potential for AI networks and compute is not yet fully unlocked.
What can integrated photonics do for AI?
As AI adoption continues to accelerate, networks must adapt to a never-seen-before surge in data. To make sure this remains possible and scalable parallel to the rising need, network devices will require specific elements that integrated photonics offers. Such as:
- High signal fidelity through low optical losses
- Broad bandwidth
- Power efficiency
- Long term reliability
A custom integrated photonics datacom pluggable solution based on silicon nitride in a CFP2 package. Device was designed and manufactured by LioniX International.
Our Technology in AI
With over two decades of experience developing low-loss PIC modules for various markets, from telecom/datacom and satellite communications to life sciences and metrology, we are now applying this expertise to the AI domain. Our TriPleX® silicon nitride platform, together with our vertically integrated, customer-focused manufacturing approach, empowers us to co-develop solutions tailored to the needs of OEMs and system integrators.
Working with silicon nitride PIC devices enables bandwidth expansion through their large transparency window and high switching speeds it enables. Its power efficiency is unparalleled, as it propagates light at almost lossless levels. TriPleX® silicon nitride further improves on these qualities with an extended transparency window of 405 nm to 2350 nm, with lithium niobate integration for best-in-class modulation. It also allows for minimal loss integration of active materials via hybrid and heterogeneous methods.
Our PIC modules integrate essential photonic functions like splitting, combining, modulation, and filtering at a chip scale. This reduces size, weight, and power consumption, while enabling high-density optical interconnects and advanced signal processing for AI systems. Our vertical integration model enables reliability at the design stage, where circuit topology is combined with device layout and manufacturing considerations. In this way, we ensure that the production is always first-time-right.
PIC Platform Capabilities
- Fully customizable silicon nitride platform
- Ultra-low insertion losses
- Ultra-low propagation losses
- Wide transparency range (405 – 2350 nm)
A representation of the input and output signals from an integrated photonics optical equalizer, manufactured for Optagon Photonics. The output signals have had the less sharply defined areas of the signal removed by the equalizer.
Signal Integration
- Edge-to-edge coupling (fibers & chips)
- Out-of-plane coupling (gratings & mirrors)
- Pocket coupling (host & guest)
- Co-packaged optics
Qualified Developments
- Spot size converters
- (De-) Multiplexers
- Optical equalizers (enabling replacement of DSPs)
Correcting Data Errors in Communication Signals
Working together with Optagon Photonics, we fabricated a novel optical equalizer that corrects distortions and data errors in communication signals. It’s the first ever such device to use photonic integrated technology to enable flexible operation across a range of data transmission speeds. Optical equalizers offer a broad range of signal transmission rates, tunability, and compactness.
With over two decades of experience in integrated photonics, we are ready to tackle the challenges posed by AI and data centers.
“We were excited to access silicon nitride technology through the LioniX International MPW. Our application required really low-loss photonics in chip volumes appropriate to our early-stage technology. The design tools and building blocks gave us and our partners an efficient way of doing the functional design, and the packaging services saved us valuable time on our end.”