ABOUT THIS PROJECT:
he FLEXFIX project will integrate an InP PIC on top of a TriPleX® PIC by flip chip assembly. The self alignment of the waveguides is done via flexible waveguides in TriPleX® and etched trenches in the InP PIC. For the InP Technical University Eindhoven is responsible. Ficontec will integrate the two chips together by flip chip technology and LioniX International will realize the flexible fingers in the TriPleX® platform.
THE ROLE OF LIONIX INTERNATIONAL:
In FLEXFIX LioniX International is developing flexible free hanging waveguides in their TriPleX® platform to enable a passive and cost effective PICassemby by self alignment of waveguides.
Find more information about this project and its progress on the FLEXFIX website.