Packaging Service

LioniX International offers several solutions and services for assembly and packaging of Photonic Integrated Circuits (PIC). These specifically apply to prototypes, demonstration models and small-volume series of end products.

LioniX International offers services to support you with the realization of your complete optical system. From singulation and characterization of bare chips and pieces of wafers to pigtailing of fibers and fiber arrays to PICs, hybrid integration of different PICs and to mounting the optical assembly including the driving electronics in standardized or customized housings.

Fiber (array) to PIC

We have extensive expertise on various kinds of integrated optical technologies like, InP, SOI, glass or TriPleX™. Our team of optical engineers have over 30 man-year of experience with attaching single fibers and fiber arrays to different kind of optical chips, fabricated using the above mentioned technologies. Standard single mode fibers or specialty fibers can be attached at one or multiple facets of the PIC.

Hybrid PIC to PIC

For applications that require the hybrid integration of multiple PIC technologies, like spotsize or mode conversion between single mode fiber and high contrast PIC technology, we offer services to assemble multiple PICs. For example a spotsize and pitch converter in TriPleX™ can be attached to an InP high contrast PIC.

Specialty fiber arrays

Besides the standard single mode fiber arrays, we also offer specialty fiber arrays. These consist of polarization maintaining or non-telecom fibers or have multiple fiber types in a single fiber array. Also the outer dimension of the fiber array can be adapted to create for example very thin fiber arrays.

Integration of electronics

Many applications require the PIC to be driven through an electronic interface. LioniX International integrates different types of electrical interfaces by wirebonding and flip-chipping to PCB or ceramics.

Photonic component package

We offer several standard and customized packages for prototype assembly. Design rules for the standardized packages are described in the design manual, available through our partner PhoeniX Software. The PIC assembly is wirebonded and strain-reliefs are added to create a robust module. Active temperature control is established through use of peltier elements and customized heatsinks to suit your application best.