LioniX International is a leading global provider of customized microsystem solutions, in particular integrated photonics-based, in scalable production volumes. We provide customized solutions for OEM’s and system Integrators, by vertical integration, from design to fully assembled modules. We continuously maintain our technology leadership secured in a strong IP position.
LioniX International B.V. is a private company and has been established in April 2016, following the acquisition of SATRAX B.V., XiO Photonics B.V. and LioniX B.V., which initiated the technology development of photonic integrated circuits for a suite of applications since 2001. Currently LioniX International employs nearly 50, highly educated people, and its management has experience in the micro/nano system technology for decades.
For whom we work
As LioniX International we focus on design and fabrication of Photonic Integrated Circuits (PIC) enabled modules based on our proprietary waveguide technology (TriPleX™). This silicon nitride based platform has specific advantages for a broad spectral operation range and provides ultra-low propagation loss. It meets the requirements for a suite of applications in Telecom/Datacom, Life Science, Metrology and in additional technologies like micro- and opto-fluidics and MEMS.
As a vertically integrated company, with core competences in design, fabrication, assembly and packaging, LioniX international addresses emerging markets such as photonic integrated modules in 5G networks, Microwave photonics, Life Science, Industrial Process Control and Space.
LioniX International works closely with its OEM clients and system integrators in product development projects. We aim for an open relationship and close collaboration and strive for an early involvement and a leading role in the development process from concept to architecture, production, assembly, test, supply and service during the life cycle of the product.
LioniX International supports the volume demands of different applications and different production life cycles through a scalable production volume and process transfer between our two manufacturing locations. Our facilities in Enschede, including the cleanroom at the Nanolab supports small to medium production volumes as well as customized state of the art process developments. Our facilities in Korea provides high volume production capability both on wafer level as well as assembly and packaging.
Key Technologies and Competences
Photonic Integrated Circuits
LioniX International offers Photonic Integrated Modules that are based on the proprietary TriPleXTM (Si3N4/SiO2) platform which supports ultra-low loss waveguide geometries and is transparent over a broad range (405-2350nm). Therefore the PIC modules can be used in a suite of applications in data/telecom, signal processing, optical detection and sensing.
High frequency (1-100 GHz) signal processing on a Photonic Integrated Circuit provides huge benefits over conventional free-space optics systems, or RF-electrical designs, in terms of performance, size, weight and power consumption. Integrated microwave photonics provides a high level of on-chip integration and enables new features and functions in data/telecom applications such as beamforming, wavelength multiplexing, filtering and quantum computing.
Since our PIC modules are also operate in the visible range, applications in Life Sciences can also benefit from photonic integration as compact robust and cost effective systems can be made. Together with an assembly method that is optimized for use of the visible light, LioniX International can offer modules for fluorescence microscopy, DNA-sequencing, Flow-cytometry and many more application that require the manipulation of light.
The TriPleX™ platform integrates well with microfluidic approaches and supports local functionalization of the surfaces. This allows further integration of (bio) sensors in Lab-on-a-chip and flow chemistry applications.
In many applications for optical metrology, one or more lasers are used to measure distances, surfaces or motion. As our PIC modules can manipulate the laser light with high precision, new compact and robust PIC modules in metrology applications are possible. Applications like: laser Interferometry (homodyne, heterodyne and multiwavelength detection), optical coherence tomography (OCT) and spectrometry benefit from the compact devices, highly integrated functions and the robust designs.
Services for Nano and MEMS Applications
Besides photonic module development, LioniX International provides a series of services regarding fabrication of thin films, Micro Electro Mechanical Systems (MEMS), nano structures and components based on numerous process steps developed in the MESA+ NanoLab, including specialties such as DRIE of glasses, Fused Silica wafer bonding and Chemical-Mechanical Polishing (CMP).
As vertical integrated company LioniX International has all the capabilities and competencies needed to transfer customer needs for our technologies into dedicated modules in scalable production volumes.